Technical Data
Product Name
Component
Applications
Features
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8540HSP-Cu
8502-Cu8540-A9000-SUP9000E-LEV
RDL，Normal pillar, Micro pillar，Mega pillar， Conformal TSV
Versatile applications, high plating speed, high purity of deposition, adjustable morphology, good uniformity, long bath life.
9200-Cu
9200-ElectrolyteTSV9200-ATSV9200-STSV9200-L
TSV
Bottom-Up filling, high aspect ratio, low overburden, high filling speed, void free, high bath stability and long bath life.
9600-Cu
9601-Electrolyte9600-A9600-S9600-L
Mega pillar
High plating speed, flat pillar profile, excellent within die and within wafer uniformity, wide operating window and PR compatibility, long bath life.
Nickel BP
Ni SulphamateNi Chloride-CONCBoric AcidBP-Wetting Agent
UBM，Barrier
matte to semi-bright dposit, ductile and low prosity deposits, excellent solderability, ease of solution maintenance.
TS4000S
TS4000S-TinTS4000S-AgTS4000S-MSATS4000S-ComplexTS4000S-PriTS4000S-Sec
Micro bump，C4 bump， Cu pillar capping
Versatile applications, high plating speed, excellent co-planarity, smooth surface morphology, good PR compatibility, long bath life, void free.